South Korean chipmaker SK Hynix, an Nvidia provider, is planning to take a position roughly USD 4 billion to construct a complicated chip packaging facility in West Lafayette, Indiana, the Wall Road Journal reported on Tuesday.
Operations on the facility may start in 2028, the report mentioned, citing folks acquainted with the matter.
SK Hynix is reviewing its plans to arrange a complicated chip packaging funding within the U.S., however has but to determine, it mentioned in a press release.
The ability is anticipated so as to add 800 to 1,000 new jobs, in response to the report.
SK pledged in 2022 to take a position USD 15 billion within the semiconductor trade via analysis and growth packages, supplies, and the creation of a complicated packaging and testing facility in america.
This month, the world’s second-largest reminiscence chipmaker started mass manufacturing of next-generation high-bandwidth reminiscence (HBM) chips utilized in synthetic intelligence chipsets, with sources saying preliminary shipments will go to Nvidia.
SK Hynix has been the only provider of the model at present used – the HBM3 – to Nvidia which has 80% of the marketplace for AI chips.
