Hero Electronix’s subsidiary, Tessolve, a semiconductor engineering options supplier, has signed an settlement to accumulate 100% of Dream Chip Applied sciences, a German semiconductor chip design firm. The deal, valued at as much as INR 400 crore (EUR 42.5 Million), is anticipated to boost Tessolve’s place within the semiconductor business, significantly in System on Chip (SoC) designs for varied sectors like AI and automotive.The acquisition will present Tessolve with turnkey design options for advanced, cutting-edge chips, strengthening its market place. The transfer will incorporate Dream Chip’s experience in SoC designs for synthetic intelligence (AI), automotive, information heart, and industrial markets, additional solidifying Tessolve’s business standing.
A lift to Tessolve’s presence
Geographically, the acquisition will considerably broaden Tessolve’s presence in Europe. The addition of 4 new supply areas in Germany and the Netherlands, together with a specialised ADAS & imaging center-of-excellence lab, highlights this enlargement. This strategic transfer underscores Tessolve’s dedication to delivering superior semiconductor and embedded design options whereas strengthening its market presence inside the semiconductor providers sector.
“This acquisition solidifies our place as a prime tier semiconductor engineering agency globally with unmatched design to productisation capabilities,” mentioned Srini Chinamilli, Co-founder & CEO of Tessolve. “Dream Chip’s capabilities additional strengthen our skill to tackle forefront ASIC design initiatives and vastly enhances our European footprint,” he added.
Dream Chip Applied sciences
Dream Chip Applied sciences, headquartered in Germany, boasts a workforce of specialized engineers and answer architects. The corporate is recognised for its prowess in advanced digital designs, establishing its repute as a number one semiconductor design service supplier within the area.
The merger will mix Dream Chip’s experience in chip structure and front-end design with Tessolve’s strengths in chip design, post-silicon take a look at, and packaging design. This collaboration will improve the corporate’s skill to supply full, turnkey chip design options. This end-to-end method will cowl all the course of from preliminary specification to quantity silicon manufacturing, providing prospects a big benefit when it comes to time-to-market and operational excellence.
“We’re excited to affix forces with Tessolve and convey our experience in digital chip design and embedded software program to a world platform. By combining our design capabilities and IP with Tessolve’s established semiconductor providers and embedded options, we will supply our prospects a really end-to-end answer from chip structure to post-silicon take a look at and provide chain administration for his or her most advanced designs,” mentioned Jens Benndorf, CEO of Dream Chip Applied sciences. “Collectively, we’ll push the boundaries of innovation in automotive and enterprise designs, significantly in camera-based programs and AI-driven ASIC functions,” he added.
Customized chip design options
The acquisition, structured as a 100% money transaction, indicators a strategic transfer in direction of capitalizing on the growing demand for customized chip design options.
Ujjwal Munjal, Chairman of Tessolve, remarked, “Over the previous few years, Tessolve has demonstrated spectacular progress and resilience. With the synergy introduced by Dream Chip Applied sciences, I’m assured that Tessolve is poised to turn into a world chief on this area with unparalleled capabilities. As main firms more and more shift in direction of customized chip design, this acquisition positions Tessolve extra strongly than ever to fulfill the rising calls for of the customized chip market.”
